Description
Specification:
Viscosity: 100 (Pa·S)
Particle size: 20-38 (um)
Alloy composition: lead tin paste
Weight: 35g
The product has good wettability, good dry resistance, and long shelf life at room temperature.
It is suitable for mobile phone repair industry, computer digital repair industry,
precision circuit board SMT soldering, BGA process soldering, etc.
It is suitable for mobile phone repair industry, computer digital repair industry,
precision circuit board SMT soldering, BGA process soldering, etc.
Package included:
1 x SMT BGA Syringe Flux Tin Soldering Paste Syringe Solder Paste RC Model Spare Part
